WebMay 1, 2007 · The etching characteristics of Ge 2 Sb 2 Te 5 (GST) films were studied with a CHF 3 /O 2 gas mixture using a reactive ion etching system. The variations of etch rates and etch profiles caused by changes in the gas-mixing ratio were investigated under constant pressure and applying power. Then the etching parameters were optimized. The etch … WebJan 27, 1998 · These investigations indicate that surface wave plasma destruction of perfluorocompounds at the point of use is a viable nonintrusive abatement technology for application to semiconductor manufacturing tools. ... Surface Wave Plasma Abatement of CHF3 and CF4 Containing Semiconductor Process Emissions. Environmental Science & …
Role of SiCl4 addition in CH3F/O2 based chemistry for Si3N4 …
Webthe CHF3/0, plasma was found to completely prevent the formation of residues in the etched regions. Possible mechanisms responsible for the prevention of residues include the formation of volatile Al-H compounds and the enhanced etching of the C-rich surface. Silicon carbide is a semiconductor exhibiting certain ... WebDec 1, 2013 · The O 2 plasma treatments can increase ITO work function, which may due to surface carbon removal, creation of surface dipoles, change in ratio of surface constituents (Sn, In, O), and Fermi level shift [8]. The increase in ITO work function improves the photo-generated holes passage from p-type semiconductor of amorphous silicon … huawei tablet t5 manual
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WebFeb 28, 2011 · The etch behaviour of Al2O3 was studied in Ar, CHF3/Ar, CF4/O2 and Cl2 low pressure RIE plasmas. The influence of dc self-bias voltage, wafer temperature, gas flow and pressure on the Al2O3 etch behaviour was investigated. This was compared with the etch behaviour of SiO2, Mo, Au and Si under the same conditions. It was found that … WebJul 25, 2014 · Adding O2 and NF3 to CHF3/C4F8/Ar plasma changed coating profiles and resulted in a disproportionate decrease of carbonyl … http://www.nanolab.uc.edu/Publications/PDFfiles/129.pdf huawei tablet vs ipad